Abstracts for posters must be submitted by e-mail to gtwang@sandia.gov, either as a MS Word file or in the body of the e-mail. The abstract deadline May 8, 2009. Abstracts should include: 1) Paper/Poster title, 2) authors’ names and affiliations, 3) the e-mail address of presenting/contact author.

Presenting authors need to register for the Symposium

We are pleased to invite you to attend the 45th NMAVS Symposium, a one-day, May 19th, focused topic Symposium with both regional and national interest. The Symposium topic will be Nanomaterials: Science and Technology. Speakers in this forum will provide an overview of the latest research in a broad area of nanomaterials ranging from nanoparticles to nanowires, along with new characterization techniques used to study these novel materials. Invited speakers include: Lincoln Lauhon o Northwestern University, Jianyu Huang o SNL, Julia Hsu o SNL, Robert Hwang o SNL/CINT, Thomas Picraux o LANL/CINT, Jennifer Hollingsworth o LANL/CINT, Sang Han o UNM, Elena Plis o UNM.
SYMPOSIUM REGISTRATION is available online at www-chne.unm.edu/avs/symregister.asp

 Abstract Submission:
Abstracts for STUDENT POSTERS (all topics) should be submitted by e-mail to gtwang@sandia.gov, either as a MS Word file or in the body of the e-mail before May 8, 2009. Abstracts should include: 1) Poster title, 2) authors' names and affiliations, 3) the e-mail address of presenting/contact author. Presenting authors need to register for the Symposium.

Additional Events (Tuesday, May 19):
         o A VENDOR SHOW concurrent with the Symposium
         o Open-topic STUDENT POSTER SESSION concurrent with the Symposium
         o A post-Symposium RECEPTION and Poster Award presentation

Related Events (Monday - Thursday, May 18-21):
         o Short Courses:
              o Operations & Maintenance • May 18-19
              o Plasma Etching & RIE • May 18-19 (1 day session also available)
              o Plasma & Ion Beam Diagnostics • May 18
              o Intro to Ellipsometry • May 18
              o Sputter Deposition • May 19-20
              o Thin Film Evaporation • May 20
              o Atomic Layer Deposition • May 21
              o Vacuum Leak Detection • May 21